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Abstract

In this letter, we present a kilovolt-class \b{eta}-Ga2O3 vertical trench Schottky barrier diode with a field plate incorporating narrow fin width (Wfin) structures of sub-micron dimensions. We used a nanolaminate dielectric comprising a stack of multiple thin TiO2 and Al2O3 layers as RESURF dielectric and for field plate edge termination. Both Wfin of 200 nm and 500 nm demonstrate excellent on-state performance with specific on-resistance (Ron,sp) of 9.8-12 mohmcm2, and 10^10 rectification ratio. A self-aligned photoresist planarization and etch-back process was employed to expose the top of the fins for Schottky contact formation, eliminating critical lithographic alignment challenges in sub-micron scale processing. We achieved a breakdown of 2.34 kV with very low leakage currents before catastrophic breakdown. The measured breakdown voltage is limited by dielectric breakdown at the trench bottom corner as verified by metal-oxide-semiconductor (MOS) test structure. TCAD simulation shows a reduced electric field at the surface of the metal-semiconductor junction due to the RESURF effect, resulting in very low reverse leakage before breakdown. The parallel plane electric field in the \b{eta} -Ga2O3 is extracted to be 3.8 MV/cm from TCAD simulations using accurately extracted drift layer doping profile from high voltage CV measurements. A power figure of merit of 0.867 GW/cm2(0.56 GW/cm2 with current spreading) was calculated. Enhanced RESURF by integration of high-k dielectrics with self-aligned photoresist planarization, offers a promising pathway towards high figure of merit, low leakage high-performance vertical devices.