High-Precision and Wafer-Scale Transfer Lithography of Commercial Photoresists via Reversible Adhesion for Sustainable Microfabrication
Qinhua Guo, Zhiqing Xu, Lizhou Yang, Jingyang Zhang, Yawen Gan, Jiajun Zhang, Jiahao Jiang, Yunda Wang
公開日: 2025/4/21
Abstract
Photolithography conventionally requires flat, rigid and stable substrates, limiting its applications in flexible, curved, and transient electronics. In this study, a breakthrough approach is reported that employs a reversibly adhesion-switchable phase-changing polymer to universally transfer commercial photoresists onto previously inaccessible substrates, overcoming fundamental limitations of conventional photolithography. Remarkably, it achieves wafer-scale (4-inch) transfer with global registration error below 60 microns and support precise patterning on solvent-sensitive, curved, microtextured or delicate surfaces. Combined with dry etching, this study demonstrates a novel route for high-resolution patterning of susceptible materials (e.g. quantum dots and organic semiconductors). The transfer method also supports a sustainable "dry lift-off" for patterning functional materials. The reusability of both the transfer carrier and photoresist introduces a new level of sustainability and scalability, establishing a significant advancement in microfabrication. Additionally, this unprecedented capability is further demonstrated by fabricating a micro-sized UV-photodetector array with wide-angle perception directly on a curved glass bottle.