Orbital Hybridization-Induced Ising-Type Superconductivity in a Confined Gallium Layer
Hemian Yi, Yunzhe Liu, Chengye Dong, Yiheng Yang, Zi-Jie Yan, Zihao Wang, Lingjie Zhou, Dingsong Wu, Houke Chen, Stephen Paolini, Bing Xia, Bomin Zhang, Xiaoda Liu, Hongtao Rong, Annie G. Wang, Saswata Mandal, Kaijie Yang, Benjamin N. Katz, Lunhui Hu, Jieyi Liu, Tien-Lin Lee, Vincent H. Crespi, Yuanxi Wang, Yulin Chen, Joshua A. Robinson, Chao-Xing Liu, Cui-Zu Chang
Published: 2025/9/6
Abstract
In low-dimensional superconductors, the interplay between quantum confinement and interfacial hybridization effects can reshape Cooper pair wavefunctions and induce novel forms of unconventional superconductivity. In this work, we employ a plasma-free, carbon buffer layer-assisted confinement epitaxy method to synthesize trilayer gallium (Ga) sandwiched between a graphene layer and a 6H-SiC(0001) substrate, forming an air-stable graphene/trilayer Ga/SiC heterostructure. In this confined light-element Ga layer, we demonstrate interfacial Ising-type superconductivity driven by atomic orbital hybridization between the Ga layer and the SiC substrate. Electrical transport measurements reveal that the in-plane upper critical magnetic field u0Hc2,|| reaches ~21.98T at T=400 mK, approximately 3.38 times the Pauli paramagnetic limit (~6.51T). Angle-resolved photoemission spectroscopy (ARPES) measurements combined with theoretical calculations confirm the presence of split Fermi surfaces with Ising-type spin textures at the K and K' valleys of the confined Ga layer strongly hybridized with SiC. Moreover, by incorporating finite relaxation time induced by impurity scattering into an Ising-type superconductivity model, we reproduce the entire temperature-dependent u0Hc2,|| phase diagram. This work establishes a new strategy to realize unconventional pairing wavefunctions by combining quantum confinement and interfacial hybridization effects in superconducting thin films. It also opens new avenues for designing scalable superconducting quantum electronic and spintronic devices through interfacial engineering.