📝 SummarXiv

Abstract

Interfacial thermal transport is a critical bottleneck in nanoscale systems, where heat dissipation and energy efficiency are strongly modulated by molecular ordering at solid-liquid boundaries. Here, using atomistic simulations of hexadecane confined by structured silica substrates, we reveal how interfacial geometry, specifically curvature, governs the density distribution and thermal transport across the interface. At flat and mildly curved surfaces, the liquid exhibits surface-templated layering, promoting efficient heat transfer, which is enhanced with increasing contact surface area. As curvature increases, this ordering breaks down, giving rise to interference-like density patterns, reduced molecular packing, and localized depletion zones. This structural reorganization leads to a systematic increase in interfacial thermal resistance (ITR), even when the contact area is kept constant. By decomposing the interface into convex ("hill" of solid) and concave ("valley" of solid) regions, we find that valleys consistently offer lower thermal resistance. In contrast, hills act as bottlenecks to heat flow. Remarkably, we show that the work of adhesion and entropy-related energy losses scale non-trivially with curvature: while adhesion increases with contact area, the entropic penalty dominates the total energy change, reflecting curvature-induced frustration of molecular alignment. These findings unveil a direct link between surface geometry, thermodynamic dissipation, and heat transport, offering new design principles for thermally tunable nanostructured materials, thermal interface coatings, and phase-change systems.